rec. | Subject | Hit Length | Description | Align.Len | E value | Bit score | % ident. | % pos. | GO associations |
61 | Q1DHP3 | 1717 | SEC16_COCIM COPII coat assembly protein SEC16... | 56 | 1.2 | 33.5 | 32 | 55 | GO:0005789; C:endoplasmic reticulum membrane; IEA:UniProtKB-SubCell. | | | | | | | | | | | | | | | | | | | | GO:0006914; P:autophagy; IEA:UniProtKB-KW.::GO:0048208; P:COPII vesicle coating; IEA:InterPro.::GO:0015031; P:protein transport; IEA:UniProtKB-KW. | 62 | P36603 | 391 | RIR2_SCHPO Ribonucleoside-diphosphate reducta... | 89 | 1.4 | 33.1 | 28 | 46 | GO:0005829; C:cytosol; IDA:PomBase.::GO:0005634; C:nucleus; IDA:PomBase.::GO:0005971; C:ribonucleoside-diphosphate reductase complex; TAS:PomBase. | | | | | | | | | | GO:0005515; F:protein binding; IPI:PomBase.::GO:0004748; F:ribonucleoside-diphosphate reductase activity, thioredoxin disulfide as acceptor; IEA:EC.::GO:0046914; F:transition metal ion binding; IEA:InterPro. | | | | | | | | | | GO:0009186; P:deoxyribonucleoside diphosphate metabolic process; IEA:InterPro.::GO:0006260; P:DNA replication; IEA:UniProtKB-KW.::GO:0009216; P:purine deoxyribonucleoside triphosphate biosynthetic process; IC:PomBase.::GO:0042278; P:purine nucleoside metabolic process; IC:PomBase.::GO:0009212; P:pyrimidine deoxyribonucleoside triphosphate biosynthetic process; IC:PomBase.::GO:0006213; P:pyrimidine nucleoside metabolic process; IC:PomBase.::GO:0090329; P:regulation of DNA-dependent DNA replication; TAS:PomBase.::GO:0007090; P:regulation of S phase of mitotic cell cycle; IC:PomBase. | 63 | Q9VE34 | 2455 | EPG5_DROME Ectopic P granules protein 5 homol... | 42 | 1.7 | 33.1 | 33 | 57 | | | | | | | | | | | | | | | | | | | | | GO:0006914; P:autophagy; IEA:UniProtKB-KW. | 64 | O43103 | 4114 | SID2_USTMA Ferrichrome siderophore peptide sy... | 89 | 9.7 | 30.8 | 33 | 49 | | | | | | | | | | | GO:0000036; F:acyl carrier activity; IEA:InterPro.::GO:0048037; F:cofactor binding; IEA:InterPro.::GO:0016874; F:ligase activity; IEA:UniProtKB-KW.::GO:0031177; F:phosphopantetheine binding; IEA:InterPro. | | | | | | | | | | |